Sample points for constructing Bivariate Cut-HDMR and CCD metamodels

This is the supplemental file for IEEE paper: Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables.  

This supplemental file contains (1) the warpage values of 201 sample points that were used to construct the Bivariate Cut-HDMR metamodel; (2) the warpage values of 1,045 sample points that were used to construct the CCD metamodel; and (3) the Monte Carlo simulation sample points that used for validation.

Please follow the procedure written in the paper with this supplemental file to build the metamodel for Bivariate Cut-HDMR and CCD.