MEMS
Our research addresses time-dependent hysteresis effects in adhesive packaged MEMS pressure sensors.
Typically calibrated inside a certain temperature and pressure range, they provide precise pressure measurements, given
that certain setting times after temperature changes are maintained. Signal errors arise when temperature changes
induce time-dependent viscoelastic relaxation in the adhesive which cannot be compensated by calibration. High precision
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An integration process for the fabrication of thin film bulk acoustic wave resonator (FBAR) above the CMOS IC is proposed. An adhesive-bonding-based film transfer technique is utilized to transfer high resistivity Si film onto a CMOS chip. Benzocyclobutene (BCB) is used as an adhesive film. It is a heat resistive polymer and processes of temperature up to 300 C are allowed on it. The CMOS is protected by BCB and thus is not damaged by plasma and chemical treatments.
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