Speech recognition in noisy environments has long posed a challenge. Typically used air conduction microphone (ACM) is susceptible to environmental noise.
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This dataset contains the data used to create figures for the manuscript Robust Complementary Logic Using Multi-Gate N/MEMS Relays. This paper presents novel complementary logic gate structures and discusses failure modes and optimization methods for these devices. A detailed comparison of metallization schemes and operational modes is included as well. In this dataset, information used to generate figure 2 (a, b), 4, 5 (a), and 6 are contained herein. Figure 2 show cases the change in response time with variations in handle layer voltage. Figure 4 present
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Our research addresses time-dependent hysteresis effects in adhesive packaged MEMS pressure sensors.
Typically calibrated inside a certain temperature and pressure range, they provide precise pressure measurements, given
that certain setting times after temperature changes are maintained. Signal errors arise when temperature changes
induce time-dependent viscoelastic relaxation in the adhesive which cannot be compensated by calibration. High precision
applications which demand absolute signal accuracies below 30Pa on chips well below 1mm scales, while the requirement
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An integration process for the fabrication of thin film bulk acoustic wave resonator (FBAR) above the CMOS IC is proposed. An adhesive-bonding-based film transfer technique is utilized to transfer high resistivity Si film onto a CMOS chip. Benzocyclobutene (BCB) is used as an adhesive film. It is a heat resistive polymer and processes of temperature up to 300 C are allowed on it. The CMOS is protected by BCB and thus is not damaged by plasma and chemical treatments.
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