MEMS
This dataset contains the data used to create figures for the manuscript Robust Complementary Logic Using Multi-Gate N/MEMS Relays. This paper presents novel complementary logic gate structures and discusses failure modes and optimization methods for these devices. A detailed comparison of metallization schemes and operational modes is included as well. In this dataset, information used to generate figure 2 (a, b), 4, 5 (a), and 6 are contained herein. Figure 2 show cases the change in response time with variations in handle layer voltage. Figure 4 presents relay life
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Our research addresses time-dependent hysteresis effects in adhesive packaged MEMS pressure sensors.
Typically calibrated inside a certain temperature and pressure range, they provide precise pressure measurements, given
that certain setting times after temperature changes are maintained. Signal errors arise when temperature changes
induce time-dependent viscoelastic relaxation in the adhesive which cannot be compensated by calibration. High precision
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An integration process for the fabrication of thin film bulk acoustic wave resonator (FBAR) above the CMOS IC is proposed. An adhesive-bonding-based film transfer technique is utilized to transfer high resistivity Si film onto a CMOS chip. Benzocyclobutene (BCB) is used as an adhesive film. It is a heat resistive polymer and processes of temperature up to 300 C are allowed on it. The CMOS is protected by BCB and thus is not damaged by plasma and chemical treatments.
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