This dataset contains laser scans of PCBs as explained in "Fault Diagnosis in Microelectronics Attachment via Deep Learning Analysis of 3D Laser Scans". On the left and right image, we have a closer look at one circuit module of a PCB , before and after die attachment. Notice the different types of glue annotated as A, B, C, D and E. On each circuit there are four glue deposits on each type where approximately the same quantity of glue has been placed. As explainedin our paper the top three deposits are used for training and the bottom one for testing.