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A dataset from semiconductor assembly and testing processes
- Citation Author(s):
-
Cheng-JueiYu
Institute for Information Industry - Submitted by:
- Cheng-Juei Yu
- Last updated:
- Thu, 04/23/2020 - 23:05
- DOI:
- 10.21227/n6jw-2337
- Data Format:
- License:
2857 Views- Categories:
- Keywords:
Abstract
A dataset from semiconductor assembly and testing processes is used to evaluate the model selection prediction method. The response variable refers to the throughput rate of a specific machine–product combination in one of the assembly and testing process steps based on historical data. This data set includes 1 response variable, 5 categorical machine and product attributes and 11 numerical attributes. The dataset contains 13186 observations.
mixed_categorical_numerical_data.csv: the raw data.
mixed_categorical_numerical_dataDummy.csv: the transformed one-hot encoded data.
Full_Model.rds: the full model built from the whole dataset.
Fundamental_Model.rds: the fundamental model built from one fundamental dataset.
Partial_Model_1-11.rds: the models related to the fundamental model mentioned above.
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