Bonding
Laminated Object Manufacturing (LOM) is an efficient rapid prototyping technology (RPT), a suitable technique with many applications. However, its application for wood product prototyping (WPP), especially in micro-thin wood objects, namely different types of wood veneers, the thermal heat effect emanating from LOM heat sources, challenge the quality of the final 3D wood products.
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An integration process for the fabrication of thin film bulk acoustic wave resonator (FBAR) above the CMOS IC is proposed. An adhesive-bonding-based film transfer technique is utilized to transfer high resistivity Si film onto a CMOS chip. Benzocyclobutene (BCB) is used as an adhesive film. It is a heat resistive polymer and processes of temperature up to 300 C are allowed on it. The CMOS is protected by BCB and thus is not damaged by plasma and chemical treatments.
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