SPICE
Peter O. Lauritzen and Cliff L. Ma proposed an approach for creating a physical model of reverse recovery for soft recovery diodes in 1991. The current paper demonstrates how to create the proper SPICE sub-circuit using only the specifications from the diode datasheet from the manufacturer. Software for characterization tools has been developed, tested, and is now openly accessible for use
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This work presents a sub-model of round or tubular wire with skin effect simulation. The model is based on numerical solving Maxwell's equations, using a time-domain simulator as a numerical analysis tool. The geometry of round wire is divided by the number of concentric tubes of variable thickness. Finite difference numerical equations for field and current density are adapted for the time-domain simulator. Voltage drop across the wire is calculated using current density in the outermost layer surface and external inductance of the wire.
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The paper describes the way of extending a basicdiode SPICE model for a possibility to simulate realistic reverserecovery of power diodes. The proposed macro model uses allbasic diode model characteristics and processes the diffusioncapacitance current for adjusting reverse recovery. A Windowsapplication tool was made to simplify creating a new diode SPICEsub-model using the manufacturer data sheet or measured data.Experimental data are presented for comparison of the proposedmodel and real diode reverse recovery
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