Our research addresses time-dependent hysteresis effects in adhesive packaged MEMS pressure sensors.
Typically calibrated inside a certain temperature and pressure range, they provide precise pressure measurements, given
that certain setting times after temperature changes are maintained. Signal errors arise when temperature changes
induce time-dependent viscoelastic relaxation in the adhesive which cannot be compensated by calibration. High precision
applications which demand absolute signal accuracies below 30Pa on chips well below 1mm scales, while the requirement
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