The dataset is a self-constructed wafer surface defect dataset, with each image captured in real-time. The extraction and segmentation of wafer image have been performed, and each image represents a single individual die. The dataset primarily includes images of defect-free dies, as well as four types of defective images: particle, scratch, stain, and liquid residual. A total of 500 images are included, and the various types of defects within the images have been annotated using the Make Sense online annotation tool.