[1] Yao Shan,
"Coperfed",
IEEE Dataport,
2024. [Online]. Available: http://dx.doi.org/10.21227/r97x-0222. Accessed: Feb. 17, 2025.
@data{r97x-0222-24,
doi = {10.21227/r97x-0222},
url = {http://dx.doi.org/10.21227/r97x-0222},
author = {Yao Shan },
publisher = {IEEE Dataport},
title = {Coperfed},
year = {2024} }
doi = {10.21227/r97x-0222},
url = {http://dx.doi.org/10.21227/r97x-0222},
author = {Yao Shan },
publisher = {IEEE Dataport},
title = {Coperfed},
year = {2024} }
TY - DATA
T1 - Coperfed
AU - Yao Shan
PY - 2024
PB - IEEE Dataport
UR - 10.21227/r97x-0222
ER -
T1 - Coperfed
AU - Yao Shan
PY - 2024
PB - IEEE Dataport
UR - 10.21227/r97x-0222
ER -
Yao Shan.
(2024).
Coperfed.
IEEE Dataport.
http://dx.doi.org/10.21227/r97x-0222
Yao Shan,
2024.
Coperfed.
Available at:
http://dx.doi.org/10.21227/r97x-0222.
Yao Shan.
(2024).
"Coperfed."
Web.
1. Yao Shan.
Coperfed [Internet].
IEEE Dataport; 2024.
Available from :
http://dx.doi.org/10.21227/r97x-0222
Yao Shan.
"Coperfed."
doi:
10.21227/r97x-0222